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Polyera to expand into Asia-Pacific with Chengwei, Tsing financing

16 Apr 2012

Chinese venture houses Chengwei and Tsing have co-led a $24.5m financing round in semiconductor technology provider Polyera to expand its Asia-Pacific operations.

The US-based company plans to prepare for a market launch in the emerging market region using the Series C funding, which will is said would be used to accelerate its development activities.

Polyera’s technology allows products such as electronic displays and photovoltaic panels to be built on to flexible structures.

Tsing Capital partner Michael Li said, “What impressed us about Polyera is the combination of the team’s depth of understanding in both technology innovation and manufacturing constraints.

“As a result, we believe Polyera has developed a technology platform which is both revolutionary and scalable, and will shape next-generation devices.”

Cleantech venture firm Tsing invests in companies through its China Environment Fund, a series of funds which focuses on cleantech environment-related investments.

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