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Samsung, Intel venture arms back $7.3m round for thin film maker Inpria

20 Feb 2014

dollar_money_currency_170sq1Corporate venture capital majors Samsung Venture Investment Corporation and Intel Capital have backed a $7.3m financing round for high-performance thin film maker Inpria Corporation.

Inpria said it had received $4.7m of the committed capital to date, most of which came from Samsung with additional backing coming from the venture capital arm of Applied Materials.

SVIC vice president Dong-Su Kim said, “Inpria is spearheading the development of a brand new approach to lithography photoresist materials.

“We look forward to Inpria completing their EUV photoresist product development.”

Intel Capital director Sean Doyle added, “Our industry needs materials innovation to continue to deliver the benefits of Moore’s Law to consumers.

“We’re excited by Inpria’s approach to driving improvements in performance and efficiency for manufacturing semiconductor devices on the leading edge of process technology.”

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